What is G line exposure?
Definition. g – line lithography. photolithography using 436 nm wavelength UV radiation for exposure; (high-intensity line at 436 nm in the spectrum of UV lamp is referred to as “g-line”).
What is the purpose of the soft bake before exposure?
The softbake reduces the remaining solvent content in order to: → avoid mask contamination and/or sticking to the mask, → prevent popping or foaming of the resist by N2 created during exposure, → improve resist adhesion to the substrate, → minimize dark erosion during development, → prevent dissolving one resist layer …
Why is exposure time important in lithography?
The exposure time is a very important value to achieve the correct dimensions of the structures. The longer the wafers are exposed to the radiation, the larger the radiated area is.
What is the purpose of photoresist?
A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to form a patterned coating on a surface. This process is crucial in the electronic industry.
What is the color of photoresist?
red color
This reaction always occurs to some extent, it causes the red color of photoresist, and it is benign as long as the DQ content is not overly depleted.
How do photoresists work?
Photoresists are polymeric materials that transfer micro- and nanoscale patterns to a substrate through a radiation-induced solubility change. Both electron beam and deep ultraviolet radiation are used to form the pattern that ultimately produces the complex circuitry of microelectronics.
What is the purpose of the soft bake?
The softbake reduces the remaining solvent content in order to: è avoid mask contamination and/or sticking to the mask, è prevent popping or foaming of the resist by N2 created during exposure, è improve resist adhesion to the substrate, è minimize dark erosion during development, è prevent dissolving one resist layer …
What is the purpose of soft bake in photolithography process?
The first photoresist bake is called soft bake; it’s done just after the spin coating of the SU-8 photoresist. Its aim is to evaporate the solvent to make the SU-8 photoresist more solid. The evaporation will change a little bit the thickness of the layer and prepare the SU-8 photoresist to be exposed to the UV.
What are the two main tasks of a photoresist?
The process of material removal following a photolithographic process is known as etching. Photoresist layers have two basic functions: 1) precise pattern formation; and 2) protection of the substrate from chemical attack during the etch process.
What are the three major components of a photoresist?
The conventional positive photoresist has three major components: a photosensitive component called the photoactive compound (PAC), a novolak resin to provide structural stability and etch resistance, and a solvent which puts the solid photoresist into liquid form for the purpose of coating a substrate.
